AMD to Support USB 3.0 in Future Chipsets
AMD has announced it will support the new USB 3.0 connection in its future computer chipsets; Intel has not announced support for the new standard as of yet.
USB 3.0, or SuperSpeed USB, has ten times the bandwidth of the current USB 2.0 standard. The USB 2.0 standard supports 480Mbps of bandwidth while the USB 3.0 standard supports 5.0Gbps. More bandwidth can greatly increase the amount of data that an external device can send at one time, such as an external hard drive. And in addition to increased bandwidth, USB 3.0 can provide more power to external devices, is more power efficient, and is backwards compatible with current USB 2.0 devices.
AMD will provide SuperSpeed USB support in its upcoming A75 and A70M Fusion chipsets, which have already started shipping. AMD did not release any other details about its chipsets. The USB 3.0 standard competes with the new Thunderbolt connection standard announced by Apple and Intel earlier this year; it is standard on the new Apple MacBook Pros.